Automation Plant, Assembly Line & Cleanroom Facilities

     
     
     
     

 

 

 

 

 

 
In Technology   

Our capabilities

  • More than 10 SMT lines with a total capacity of more than 100 million mounting points in a month, with solder paste printing and adhesive bond dispensing capabilities.

  • Fine pitch placement of up to 0201 (0603) chips.

  • Integrated Circuit (IC), Quad Flat Package (QFP), Ball Grid Array (BGA) and Chip Scale Package (CSP) mounting enabled.

  • Lead-free soldering process with N2 rectofeed capability.

  • Auto-insertion machines with Eyelet, Jumper, Axial and Radial Technology.

  • New Product Introduction (NPI), Engineering and Prototype-Built with applied Design For Excellency (DFX).

  • Complete Box Build and Turnkey Projects.

  • End Product Life Cycle (PLC) and Rework.

  • Medical assembly with Class 10K Cleanroom Facilities.

We are endowed with state-of-the-art equipment to support our know-how shown as below :-

  • Surface Mout Insertion Machines
  • Auto-insertion Machines
  • Auto-optical Inspection systems
  • Spray Fluxers
  • Wave Soldering Machines
  • ICT Testers
  • BGA Rework Stations
  • Solder Paste Inspection Machines (SPI)
  • X-Ray Inspection Systems
  • Ultra-sonic Welding Machines  
  • CCTV Security and Featuring Systems
  • PCB Routing Machine
  • RF & Digital TV laboratory Equipments
  • CMM, Profile Projector
  • Temperature Chamber

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